NEWS

[ 2019/1/3 ]

Thank you for visiting our booth in 11th AUTOMOTIVE WORLD 2019
[Dates] January 16[Wed]-18[Fri],2019 10:00-18:00 (last day until 17:00)
[Venue] Tokyo Big Sight Japan
 
New Products/Solution showcased at our booth

Ultrasonic Servo Metal Welder
SDB servo-metal welder displays remarkable performance for the welding of especially aluminum and copper materials.
 
Vacuum & Pressure Reflow Oven VPF
Unique heating and cooling system provides versatile and efficient process.
 

Please see  Link to the products detail at out booth for more detail.

 

[ 2018/2/26 ]

Thank you for visiting us in JISSO PROTEC 2018

 

New Products/Solution showcased at our booth
New Table-top Single Solder Ball Placement System STM-II
for prototyping, R&D, and repair(re-balling) of BGA type IC packages and substrates.

New STM-II is capable of ball placement with BGA coordinates data uploaded from PC via Ethernet. Thus, complex BGA pattern with different ball pitches is also available.
The unique single solder ball separation unit enable to place solder ball on a BGA whatever the placement pattern will be.
The new digital controlled flux dispenser and flux temperature controller ensure consistent and accurate flux application.
  product photo