|Large Wire Bonder SHB-150R for Manual/Semi-Automatic bonding|
SHB-150R is a manual/semiautomatic wedge bonder for large diameter aluminum or copper bonding wire and ribbon.
The compact table-top unit is ideal for laboratory, prototyping and small scale production.
|Single solder ball placement system STM-203FB|
|Table-top solder ball mounter for BGA type IC packages, is capable of placement ball diameter of 0.2mm above. Easy programmable ball matrix pattern with touch panel.|
|Precision Reballing Unit SMU-50 for BGA and CSP|
|SMU-50 is a precision solder ball re-balling unit for BGA type IC packages, using metal masks for solder paste and ball placement.|
|Table-top Batch Reflow Oven SVO-1|
|High efficient Carbon Lamp Heater equipped, compact reflow oven SVO-1 is available not only for reflow soldering, but also for curing thermoset adhesive, heat treatment and drying with constant temperature etc as versatile heating oven.|
|Table-top Batch Reflow Oven STR-3000RC/3100RC|
|Small footprint compact reflow oven STR has two way reflow temperature profile control with 5 steps setting for ramp rate and dwell time.|