SHINAPEX CO., LTD.
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Large Wire Bonder SHB-150R for Manual/Semi-Automatic bonding |
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SHB-150R is a manual/semiautomatic wedge bonder for large diameter aluminum or copper bonding wire and ribbon. The compact table-top unit is ideal for laboratory, prototyping and small scale production. |
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Single solder ball placement system STM-203FB |
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| Table-top solder ball mounter for BGA type IC packages, is capable of placement ball diameter of 0.2mm above. Easy programmable ball matrix pattern with touch panel. |
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Precision Reballing Unit SMU-50 for BGA and CSP |
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| SMU-50 is a precision solder ball re-balling unit for BGA type IC packages, using metal masks for solder paste and ball placement. |
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Table-top Batch Reflow Oven SVO-1 |
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| High efficient Carbon Lamp Heater equipped, compact reflow oven SVO-1 is available not only for reflow soldering, but also for curing thermoset adhesive, heat treatment and drying with constant temperature etc as versatile heating oven. |
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Table-top Batch Reflow Oven STR-3000RC/3100RC |
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| Small footprint compact reflow oven STR has two way reflow temperature profile control with 5 steps setting for ramp rate and dwell time. |
