Ultrasonic Micro Bonding Unit SWB-105/SWB-150 is ideal for ultrasonic micro joining experiments using various minute metal materials for microelectronics applications.
The bonding head assembly is also applicable to be integrated into various type of material handling system for medium to high volume production.
The standard System is composed of height adjustable bonding head, rack and pinion driven manual X-Y table with individual locks in X and Y direction,
work stage with mechanical clamp, ultrasonic controller, bonding force and time controller,
and microscope joint as a minimum necessary but essential composition for ultrasonic bonding experiment.
In order to secure consistent bonding, our originally developed bonding force controller with force feedback
control can let the user simply adjust the bonding head level so that the tool can always be perpendicular to bond
material surface when it contacts to the material. Thus consistent intermetallic joining can be obtained.
It performs ultrasonic bonding of aluminum and copper material such as round wire or ribbon wire on various metal surface.