Single Solder Ball Placement System Ball Mounter MODEL: STM-203FB Back to Product List

The new Table-top Single Solder Ball Placement System model STM-203FB is designed specially for prototyping, R&D, low volume production and re-balling for Ball Grid Array type IC packages and substrates.

Newly adopted Color Wide Touch Screen for both machine operation and parameter setting enable to simply set various kind of ball placement pattern, also display camera image.

Solder ball placement can be made with unique solder ball separation unit which is simply replaceable. The system has built -in flux Dispenser which enable to apply appropriate volume of flux accurately on each pads of BGA according to the placement pattern being set beforehand.
See the introduction video

a a
Touch panel for operation
and parameter setting
Solder ball placement head

icon Capability/Function
Ball diameter 0.2mm - 0.76mm dia.
Placement accuracy +/- 50 micron ( 2mil)
Placement speed 1.0 - 1.3sec/sphere
Board size 120mm x 60mm
CCD Camera unit Color CCD for placement positioning and visual inspection
Utility 100-120/200-230VAC SP, 7A
Dimensions 750(W) x 540(D) x 385(H)mm

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