PRODUCTS

icon Large Wire Bonder SHB-150 for Manual/Semi-Automatic bonding Large Wire Bonder SHB-150 for Manual/Semi-Automatic bonding
SHB-150 is a manual/semiautomatic wedge bonder for large diameter bonding wire and ribbon wire. The compact table -top unit is ideal for laboratory, prototyping and small scale production.
icon Single solder ball placement system STM-203FB Single solder ball placement system STM-203FB
Ball placement for 0.2mm - 0.75mm dia. solder ball. Easy programmable ball matrix pattern with touch panel.
icon Precision Reballing unit SMU-50 for BGA and CSP Precision Reballing unit SMU-50 for BGA and CSP
SMU-50 is suitable for prototyping and reballing of ball grid allay components such as BGA, CSP.
icon Table-top Versatile Batch Oven SVO-1 Table-top Versatile Batch Oven SVO-1
Compact versatile oven SVO-1 is suitable for reflow soldering, applications with thermoset adhesive, heat treatment and drying with constant temperature etc.
icon Table-top Batch Reflow Oven STR-3000RC/3100RC Table-top Batch Reflow Oven STR-3000RC/3100RC
Small footprint Batch reflow oven with unique temperature feed back control feature. Available for reflow soldering and heating test.