{"id":2840,"date":"2018-02-22T23:20:31","date_gmt":"2018-02-22T14:20:31","guid":{"rendered":"http:\/\/shinapex.co.jp\/news\/?page_id=2840"},"modified":"2024-08-13T11:12:07","modified_gmt":"2024-08-13T02:12:07","slug":"products","status":"publish","type":"page","link":"https:\/\/shinapex.co.jp\/news\/engtop\/products\/","title":{"rendered":"PRODUCTS"},"content":{"rendered":"\n\n\n

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SHINAPEX Original Products<\/h2>\n
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\"icon\"<\/td>\n\nVacuum & Pressurizing Reflow Soldering Oven VPF300<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nCapable of both vacuum and pressurizing process, minimize voids in solder joint. Fluxless reflow soldering with formic acid vapor or forming gas is also available. Large work area and rapid cooling system drastically reduce process cycle time in flux-less and void-free soldering.\n<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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\"icon\"<\/td>\n\nVacuum Reflow Soldering Oven TVF200<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nA cost-effective and space-saving desktop vacuum reflow oven ideal for void-free soldering process development and prototyping. \nThe pressure inside the process chamber can be varied from atmospheric pressure down to 10Pa in a short time. TVF200 can also support flux-less soldering with an optional formic acid bubbler unit.\n<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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\"icon\"<\/td>\n\nTable-top Batch Reflow Oven SVO-1<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nThe SVO-1 is equipped with a highly efficient Carbon Lamp Heater, making the compact reflow the perfect tool for reflow soldering. This versatile heating oven can even be used for curing thermoset adhesive, heat treatment and drying with a constant temperature.\n<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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\"icon\"<\/td>\n\nTable-top Batch Reflow Oven SVO-1 Plus<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nCompact Table-top reflow oven SVO-1 Plus further improved its heating capacity and temperature uniformity oven SVO-1. The output power of each heater is adjustable individually to optimize the thermal uniformity per application as well as shortening the process cycle time.\n<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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\"icon\"<\/td>\n\nSingle solder ball placement system STM-II<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nThis table-top solder ball mounter for BGA type IC packages is capable of placing a ball of solder with a diameter of 0.2 mm and above. With the touch panel, user can quickly and easily program ball matrix patterns.\n<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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\"icon\"<\/td>\n\nMicro solder ball placement system STM-Micro<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nSTM-Micro meat demand of micro ball mounting on a wafer level package, single ball mount on a missing ball pad, re-balling, and partial ball mounting for analysis etc. Unique single-shot ball separation\/singulation method ensures that each solder ball is separated and placed one by one, thus very few balls are wasted.<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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\"icon\"<\/td>\n\nServo-driven Ultrasonic Metal Welder SDB<\/strong><\/a>\n<\/td>\n <\/td>\n\n
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\nInnovative Servo-controlled Ultrasonic Metal Welder for quality metal welding. Thanks to the servo-press control, ultrasonic energy can be efficiently transmitted to a work piece, resulting in a shorter time cycle than a conventional ultrasonic welder with a pneumatic press. SDB provides reliable bonding in key manufacturing areas such as automotive wire harnesses, lithium ion batteries, and power electronics.\n<\/td>\n<\/tr>\n<\/tbody><\/table>\n
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SHINAPEX Original Products Vacuum & Pressurizing Reflow Soldering Oven VPF300   Capable of both vacuu […]<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":2828,"menu_order":0,"comment_status":"open","ping_status":"open","template":"eng-base.php","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"class_list":["post-2840","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2840","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/comments?post=2840"}],"version-history":[{"count":33,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2840\/revisions"}],"predecessor-version":[{"id":5161,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2840\/revisions\/5161"}],"up":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2828"}],"wp:attachment":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/media?parent=2840"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}