{"id":2852,"date":"2018-02-22T23:41:30","date_gmt":"2018-02-22T14:41:30","guid":{"rendered":"http:\/\/shinapex.co.jp\/news\/?page_id=2852"},"modified":"2025-08-05T16:58:48","modified_gmt":"2025-08-05T07:58:48","slug":"product03","status":"publish","type":"page","link":"https:\/\/shinapex.co.jp\/news\/engtop\/products\/product03\/","title":{"rendered":"Single Solder Ball Mounter STM-II"},"content":{"rendered":"\n\n\n\n
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Solder Ball Mounter STM-II Advance<\/b><\/h1>\n<\/td>\n

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Table-top Single-shot Solder Ball Placement System “STM-II” is available for automatic BGA reballing, high-mix low volume production and R&D of BGA type IC packages.<\/b><\/h2>\n

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\nSolder ball placement can be made with unique solder ball separation unit which is specially designed per ball size and simply interchangeable. Sine solder ball is precisely mounted one by one onto BGA substrate, very few balls are wasted unlike manual ball mounting using metal stencils.
\nThe machine operation with color wide touch screen enable to simply set various kind of BGA ball matrix pattern.
\nThe system also includes flux dispenser with accurate flux temperature control module which enable to apply consistent volume of flux on each ball pads of BGA according to the BGA pattern being set on the touch panel beforehand.
\nSTM-II Advance provides automated and stable ball placement solution for BGA type IC packages without dependent of operators skill, eliminates time wasting and solder ball losses.\n<\/td>\n		 <\/td>\n\n
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Ball separation unit is simply interchangeable<\/td>\n		 <\/td>\n
Single-shot ball placement on a BGA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

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Ball placement on multiple BGAs<\/td>\n		 <\/td>\n\"\"
Vision system for automatic offset of ball placement position
and missing ball inspection<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

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Video<\/b>  0.3mm solder ball placement.<\/p>\n