{"id":2852,"date":"2018-02-22T23:41:30","date_gmt":"2018-02-22T14:41:30","guid":{"rendered":"http:\/\/shinapex.co.jp\/news\/?page_id=2852"},"modified":"2026-09-07T15:00:55","modified_gmt":"2026-09-07T06:00:55","slug":"product03","status":"publish","type":"page","link":"https:\/\/shinapex.co.jp\/news\/engtop\/products\/product03\/","title":{"rendered":"Single Solder Ball Mounter STM-II"},"content":{"rendered":"\n\n \n \n
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Solder Ball Mounter STM-II Advance<\/b><\/h1>\n <\/td>\n

\n \n \"Back\n <\/a>\n <\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n\n
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The STM-II tabletop single-shot solder ball placement system is designed for automated BGA reballing, high-mix, low-volume production, and R&D for BGA-type IC packages.<\/b><\/h2>\n

 <\/p>\n\n \n \n \n
\n Ball placement is powered by a unique, easily interchangeable separation unit specially designed for each ball size. Because solder balls are mounted precisely one by one onto the substrate, material waste is virtually eliminated compared to manual mounting with metal stencils.

\n The wide color touchscreen interface allows users to easily configure various BGA ball matrix patterns.

\n The system also features a flux dispenser with a high-precision temperature control module, ensuring a consistent application of flux onto each BGA pad according to the pre-programmed pattern.

\n The STM-II Advance delivers an automated, consistent placement process independent of operator skill, minimizing cycle time and eliminating solder ball loss.\n <\/td>\n 		 <\/td>\n \n \n
\n \n \"STM-II\n <\/a>\n <\/figure>\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n

 <\/p>\n\n \n \n \n
\n \"Easily
\n Easily interchangeable ball separation unit\n <\/td>\n 		 <\/td>\n \n \"Single-shot
\n Single-shot ball placement on a BGA\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n

 <\/p>\n\n \n \n \n
\n \"Ball
\n Ball placement on multiple BGAs\n <\/td>\n 		 <\/td>\n \n \"Vision
\n Vision system for automatic alignment offset and missing-ball inspection\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n

 <\/p>\n\n

Video<\/b>  0.3mm solder ball placement.<\/p>\n \n