{"id":2993,"date":"2019-04-11T15:38:45","date_gmt":"2019-04-11T06:38:45","guid":{"rendered":"http:\/\/shinapex.co.jp\/news\/?page_id=2993"},"modified":"2024-02-23T14:17:11","modified_gmt":"2024-02-23T05:17:11","slug":"vpf300","status":"publish","type":"page","link":"https:\/\/shinapex.co.jp\/news\/engtop\/products\/vpf300\/","title":{"rendered":"VPF 300"},"content":{"rendered":"\n\n\n\n
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Vacuum & Pressure Reflow Oven VPF300<\/b><\/h1>\n<\/td>\n

\"Back<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
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VPF Vacuum & Pressure Reflow Oven is the perfect tool with a wide range of uses, from process development to high-mix low-volume production of fluxless and void-free soldering\n<\/b><\/h2>\n
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The VPF vacuum and pressure reflow oven has a wide heating area coupled with a unique rapid cooling function that expedites the cooling process leading to enhanced productivity.<\/p>\n

The VPF is not only capable of the conventional vacuum process but also pressurized process up to 0.4Mpa. This allows for a wide degree of variation of the pressure inside the chamber. Thus, voids in the solder joint can be minimized, resulting in nearly void free soldering.<\/p>\n

VPF is also capable of flux-less soldering by the reduction of oxide film by formic acid vapor. The system can be equipped with a formic acid babbler with a liquid temperature control which can supply Nitrogen gas mixed with formic acid at a constant concentration into the process chamber. Forming gas is also available for the same purpose.<\/p>\n

With the outstanding functions available on the VPF, users are offered a lot of flexibility in terms of fluxless and void-free soldering.<\/p>\n<\/td>\n

\"vpf300\"<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n

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Effective void-free soldering<\/b><\/p>\n\n\n\n
X-ray images of solder joint between 10x10mm chip and copper substrate using SAC305 solder paste printed in 0.2mm thickness. In the reflow soldering process combined wtih vacuum and pressurizing, nearly void-free solder joint is achieved.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n
\"normal-reflow\"
Normal atmospheric pressure<\/td>\n		 <\/td>\n\"vac-soldering\"
with vacuum<\/td>\n		 <\/td>\n\"vac-with-pressure\"
with vacuum + pressurizing<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
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\n\"\"Features and Benefits<\/b>\n
    \n\t
  • Wide practicable heating area<\/li>\n\t
  • Rapid cooling function<\/li>\n\t
  • 0.4Mpa pressurizing process available<\/li>\n\t
  • Max. 450 degree C heating capability<\/li>\n\t
  • Flat carbon element IR heater with good thermal uniformity<\/li>\n\t
  • Formic acid bubbler with thermal function<\/li>\n\t
  • Built-in low vibration dry vacuum pump<\/li>\n\t
  • Data logging PC software available<\/li>\n\t
  • Multiple gas lines for various process development<\/li>\n\t
  • Flexible process setting and operation with 7\u201d touch panel<\/li>\n\t
  • Linkage with formic acid monitor (option)<\/li>\n<\/ul>\n<\/td>\n
\"vpf300_plate\"High rigid process chamber with
Max 0.4Mpa pressurizing capability<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n

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\n\n\n\n
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\"temp<\/td><\/tr>\n
Setting and editing of temperature, pressure and gas line can be done flexibly on the touch panel.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/td>\n\n

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\"profille<\/td>\n<\/tr>\n
Temperature and pressure profile can be stored.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n\n\n\n

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\"\"Basic Specifications<\/b><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
MODEL<\/td>\nVPF300<\/td>\n<\/tr>\n
Process area<\/td>\n300mm x 300mm<\/td>\n<\/tr>\n
Max. temperature<\/td>\n450\u00b0C<\/td>\n<\/tr>\n
Vacuum level<\/td>\n10Pa (Built-in clean dry vacuum pump)<\/td>\n<\/tr>\n
Max. positive pressure<\/td>\n0.4MPa<\/td>\n<\/tr>\n
Process gases<\/td>\nN2 gas, forming gas, N2 mixed with formic acid<\/td>\n<\/tr>\n
Machine size<\/td>\nW783mm x D735mm x H1470mm<\/td>\n<\/tr>\n
Weight<\/td>\nApprox.200kg<\/td>\n<\/tr>\n
Power<\/td>\nAC200V or AC230V Three phase, Max.45A<\/td>\n <\/td>\n<\/tr>\n
Others<\/td>\nFormic acid bubbler with temperature control (option)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n

\u25a0<\/span>Related product<\/b>
\n\"\" Vacuum Reflow Oven TVF200<\/a><\/p>\n

 <\/p>\n

\"icon\"For more detail, please  CONTACT US<\/a><\/b><\/div>\n\n\n","protected":false},"excerpt":{"rendered":"

Vacuum & Pressure Reflow Oven VPF300 VPF Vacuum & Pressure Reflow Oven is the perfect tool with a wide […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":2840,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"eng-base.php","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"class_list":["post-2993","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2993","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/comments?post=2993"}],"version-history":[{"count":64,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2993\/revisions"}],"predecessor-version":[{"id":5028,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2993\/revisions\/5028"}],"up":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2840"}],"wp:attachment":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/media?parent=2993"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}