{"id":5003,"date":"2024-02-22T15:58:20","date_gmt":"2024-02-22T06:58:20","guid":{"rendered":"https:\/\/shinapex.co.jp\/news\/?page_id=5003"},"modified":"2024-05-02T16:43:21","modified_gmt":"2024-05-02T07:43:21","slug":"tvf200","status":"publish","type":"page","link":"https:\/\/shinapex.co.jp\/news\/engtop\/products\/tvf200\/","title":{"rendered":"Table-top Vacuum Reflow Oven TVF200"},"content":{"rendered":"\n\n\n\n
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Table-top vacuum reflow oven TVF200<\/b><\/h1>\n<\/td>\n

\"Back<\/a><\/td><\/tr>\n<\/tbody>\n<\/table>\n
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Capable of heating up to 450\u2103, process to remove oxide film with formic acid available, fast board cooling function as standard, space-saving tabletop type, cost effective vacuum reflow oven TVF200.<\/b><\/h2>\n\n\n\n
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TVF200 vacuum soldering process significantly reduces voids inside the solder by changing the pressure inside the process chamber, enabling high-quality void-free soldering.
Usable heating area of 200mm x 200mm with 50mm space in height, supports heating from top and bottom of workpiece. The pressure can be set freely from atmospheric pressure to 10Pa, and the pressure and heating profile can be flexibly and simply programmable on a touch panel.
\nBy using a formic acid bubbler unit (optional) with its temperature control function, a mixed gas of formic acid and nitrogen gas is generated at a stable concentration. The process with its mixture gas removes oxide film on the workpiece, enable a flux-less soldering.<\/h2>\n

\"soldering\"<\/p>\n<\/td>\n

 <\/td>\n\n\"\"\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n\n\n\n\n
Void reduction effect by vacuum reflow soldering.<\/b>
X-ray image of a sample of 10x10mm copper pieces reflow soldered.
The photo on the left shows reflow soldering at constant pressure (atmospheric pressure), and the photo on the right shows reflow soldering while varying the pressure inside the process chamber.<\/td>\n<\/tr>\n
\"reflow<\/td>\n<\/tr>\n<\/tbody><\/table>\n\n\n\n
 <\/td>\nIn atmospheric reflow, there is no pressure change in the atmosphere, so the solder solidifies while voids remain trapped.<\/td>\n<\/tr>\n
 <\/td>\nBy varying the pressure inside the process chamber from atmospheric pressure to a vacuum of around 10 Pa, voids in the solder can be significantly reduced.<\/td>\n<\/tr>\n<\/tbody><\/table>\n

<\/h2>\n\n\n\n
\n

\"\"TVF200 Features<\/b>

<\/p>\n\n

  • 200x200mm heating area<\/li>\n
  • Supports heating up to 450\u2103<\/li>\n
  • heater power adjustable for each IR heater<\/li>\n
  • Save process time with fast cooling function<\/li>\n
  • Flexible process setting based on time, temperature, and pressure<\/li>\n
  • 4 thermocouples available for temperature measurement inside the vacuum chamber<\/li>\n
  • Equipped with 3 gas lines<\/li>\n
  • Bubbler to mix nitrogen gas and formic acid (optional)<\/li>\n<\/features><\/h2>\n

    \"\"<\/p>\n<\/td>\n

    		•  <\/td>\n\n\"\"\n

    Options such as dry vacuum pumps, formic acid bubblers, and dedicated racks are also available.<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

    \"\"Specifications<\/b><\/p>\n\n\n\n\n\n\n\n\n\n
    Effective heating area<\/td>\n200mm x 200mm<\/td>\n<\/tr>\n
    Set temperature<\/td>\nMax 450\u2103<\/td>\n<\/tr>\n
    Ultimate vacuum<\/td>\n10Pa (depends on dry vacuum pump capacity)<\/td>\n<\/tr>\n
    Supported gas<\/td>\nNitrogen gas, formic acid mixed gas, forming gas, He gas, etc.<\/td>\n<\/tr>\n
    Dimensions<\/td>\nW622mm x D597mm H775mm (including indicator light)<\/td>\n<\/tr>\n
    Weight<\/td>\nApprox. 65kg<\/td>\n<\/tr>\n
    Power supply<\/td>\nThree-phase 200V, 8kW<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

     <\/p>\n

    \u25a0<\/span>Related product<\/b>
    \n\"\" Vacuum & Pressure Reflow Oven VPF300<\/a><\/p>\n

     <\/p>\n

    \"icon\"For more detail, please  CONTACT US<\/a><\/b><\/p>\n<\/div>\n\n\n","protected":false},"excerpt":{"rendered":"

    Table-top vacuum reflow oven TVF200 Capable of heating up to 450\u2103, process to remove oxide film with formic ac […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":2840,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"eng-base.php","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"class_list":["post-5003","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/5003","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/comments?post=5003"}],"version-history":[{"count":13,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/5003\/revisions"}],"predecessor-version":[{"id":5093,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/5003\/revisions\/5093"}],"up":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2840"}],"wp:attachment":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/media?parent=5003"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}