{"id":5003,"date":"2024-02-22T15:58:20","date_gmt":"2024-02-22T06:58:20","guid":{"rendered":"https:\/\/shinapex.co.jp\/news\/?page_id=5003"},"modified":"2026-09-07T10:51:02","modified_gmt":"2026-09-07T01:51:02","slug":"tvf200","status":"publish","type":"page","link":"https:\/\/shinapex.co.jp\/news\/engtop\/products\/tvf200\/","title":{"rendered":"Table-top Vacuum Reflow Oven TVF200"},"content":{"rendered":"\n\n\n \n \n
\n

Table-top Vacuum Reflow Oven TVF200<\/h1>\n <\/td>\n

\n \n \"Back\n <\/a>\n <\/td>\n <\/tr>\n <\/tbody>\n<\/table>\n\n
\n \n

\n Cost-effective, space-saving tabletop vacuum reflow oven capable of heating up to 450\u00b0C, featuring standard fast cooling and optional formic acid reduction.\n <\/h2>\n\n \n \n \n \n
\n

\n The TVF200 vacuum soldering process significantly reduces voids inside solder joints by modulating the chamber pressure, achieving high-quality, void-free soldering.\n <\/p>\n

\n Featuring an effective heating area of 200 mm \u00d7 200 mm with 50 mm clearance in height, it supports heating from both the top and bottom of the workpiece. The chamber pressure can be flexibly controlled from atmospheric pressure down to 10 Pa, and both pressure and temperature profiles can be easily programmed via the intuitive touch panel.\n <\/p>\n

\n By utilizing the optional formic acid bubbler unit with temperature control, a formic acid and nitrogen gas mixture is supplied at a stable concentration. This reduction process removes surface oxide films, enabling flux-free soldering.\n <\/p>\n

\n \"Soldering\n <\/p>\n <\/td>\n

\n \"TVF200\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n \n \n \n \n \n
\n Void Reduction Effect by Vacuum Reflow Soldering<\/strong>
\n X-ray inspection images of 10 \u00d7 10 mm copper sample pieces after reflow soldering.
\n The left image shows conventional reflow soldering at atmospheric pressure, while the right image shows vacuum reflow soldering under modulated chamber pressure.\n <\/td>\n <\/tr>\n
\n \"Reflow\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n \n \n \n \n
\u2022<\/td>\n In atmospheric reflow, voids remain trapped inside the solder as it solidifies without pressure variation.<\/td>\n <\/tr>\n
\u2022<\/td>\n By reducing the pressure in the process chamber from atmospheric pressure down to approximately 10 Pa, voids in the solder joint are drastically reduced.<\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n \n \n \n \n
\n

\n \"\"TVF200 Features\n <\/h3>\n
    \n
  • 200 \u00d7 200 mm effective heating area<\/li>\n
  • Heating capability up to 450\u00b0C<\/li>\n
  • Individual power adjustment for each IR heater<\/li>\n
  • Reduced cycle times with rapid cooling function<\/li>\n
  • Flexible process profiling based on time, temperature, and pressure<\/li>\n
  • 4 thermocouples included for in-chamber temperature measurement<\/li>\n
  • Equipped with 3 gas supply lines<\/li>\n
  • Formic acid bubbler unit for N\u2082\/HCOOH mixed gas (optional)<\/li>\n <\/ul>\n

    \n \"Chamber\n <\/p>\n <\/td>\n

\n \"TVF200\n

\n Options such as dry vacuum pumps, formic acid bubblers, and dedicated mounting racks are available.\n <\/p>\n <\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n \n

\n \"\"Specifications\n <\/h3>\n \n \n \n \n \n \n \n \n \n
Effective heating area<\/th>\n 200 mm \u00d7 200 mm<\/td>\n <\/tr>\n
Set temperature<\/th>\n Max. 450\u00b0C<\/td>\n <\/tr>\n
Ultimate vacuum<\/th>\n 10 Pa (depends on dry pump specification)<\/td>\n <\/tr>\n
Supported gases<\/th>\n N\u2082, Formic acid mixed gas, Forming gas, He, etc.<\/td>\n <\/tr>\n
Dimensions<\/th>\n W622 mm \u00d7 D597 mm \u00d7 H775 mm (including signal tower)<\/td>\n <\/tr>\n
Weight<\/th>\n Approx. 65 kg<\/td>\n <\/tr>\n
Power supply<\/th>\n 3-phase 200 V, 8 kW<\/td>\n <\/tr>\n <\/tbody>\n <\/table>\n\n \n

\n \u25a0<\/span> Related Product<\/strong>
\n \"\"\n Vacuum & Pressure Reflow Oven VPF300<\/a>\n <\/p>\n\n

\n \"icon\"\n For more details, please CONTACT US<\/a><\/strong>.\n <\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"

Table-top Vacuum Reflow Oven TVF200 Cost-effective, space-saving tabletop vacuum reflow oven capable of heatin […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":2840,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"eng-base.php","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"class_list":["post-5003","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/5003","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/comments?post=5003"}],"version-history":[{"count":15,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/5003\/revisions"}],"predecessor-version":[{"id":6641,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/5003\/revisions\/6641"}],"up":[{"embeddable":true,"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/pages\/2840"}],"wp:attachment":[{"href":"https:\/\/shinapex.co.jp\/news\/wp-json\/wp\/v2\/media?parent=5003"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}