Solder Ball Mounter STM-II Advance

The STM-II tabletop single-shot solder ball placement system is designed for automated BGA reballing, high-mix, low-volume production, and R&D for BGA-type IC packages.

Ball placement is powered by a unique, easily interchangeable separation unit specially designed for each ball size. Because solder balls are mounted precisely one by one onto the substrate, material waste is virtually eliminated compared to manual mounting with metal stencils.

The wide color touchscreen interface allows users to easily configure various BGA ball matrix patterns.

The system also features a flux dispenser with a high-precision temperature control module, ensuring a consistent application of flux onto each BGA pad according to the pre-programmed pattern.

The STM-II Advance delivers an automated, consistent placement process independent of operator skill, minimizing cycle time and eliminating solder ball loss.

Easily interchangeable ball separation unit

Single-shot ball placement on a BGA

Ball placement on multiple BGAs

Vision system for automatic alignment offset and missing-ball inspection

Video 0.3mm solder ball placement.

Specification

Ball diameter	0.2mm – 1.0mm dia.
Placement accuracy	Within 50 microns (2 mil)
Ball placement speed	0.8 – 1.0 sec/sphere
Board size	60mm x 120mm standard (Custom fixtures for multiple BGAs available as an option)
Camera unit	Standard camera for manual alignment and visual inspection (Automated vision system available as an option)
Utility	100 VAC, 5 A (External transformer available for 110 V–230 V)
Dimensions	D720 x W880 x H870 mm (with LCD monitor)

■Related Products

	Micro solder ball placement system STM-Micro
	The STM-Micro meets the demands of micro-ball mounting, capable of handling micro solder balls of 80 microns in diameter or larger.

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