NEWS

[ 2019/5/15 ]

We participate in JISSO PROTEC 2019

  • Venue: West Hall 1-4 + Conference Center, Tokyo Big Sight, Tokyo Japan
  • Exhibition Period: Wednesday – Friday, June 5 – 7, 2019. 10:00 a.m. to 5:00 p.m.
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    New Products/Solution showcased at our booth

  • New Compact Vacuum Pressure Reflow Oven for void-less and flux-free soldering
  • Table-top single solder ball mounter for reballing, repair and prototyping of BGA package
  •  

    [ 2019/3/5 ]

    Thank you for visiting at PURBEST TECHNOLOGY booth

     

    Table-top solder ball mounter STM will be displayed at PURBEST TECHNOLOGY booth E2.2860 in Productronica China 2019

    March 20 – 22, 2019 at The Shanghai New International Expo Centre

    Link to the exhibitor information

     

    Table-top Single Solder Ball Placement System STM
    for prototyping, R&D, and repair(re-balling) of BGA type IC packages and substrates.

    The unique single solder ball separation unit enable to place solder ball on a BGA whatever the placement pattern will be.
    product photo

     

    [ 2019/1/3 ]

    Thank you for visiting our booth in 11th AUTOMOTIVE WORLD 2019
    [Dates] January 16[Wed]-18[Fri],2019 10:00-18:00 (last day until 17:00)
    [Venue] Tokyo Big Sight Japan
     
    New Products/Solution showcased at our booth

    Ultrasonic Servo Metal Welder
    SDB servo-metal welder displays remarkable performance for the welding of especially aluminum and copper materials.
     
    Vacuum & Pressure Reflow Oven VPF
    Unique heating and cooling system provides versatile and efficient process.
     

    Please see  Link to the products detail at out booth for more detail.