|Servo-driven Ultrasonic Metal Welder SDB|
|Innovative Servo-controlled Ultrasonic Metal Welder for quality metal welding. Thanks to the servo-press control, ultrasonic energy can be efficiently transmitted to a work piece, resulting in a shorter time cycle than a conventional ultrasonic welder with a pneumatic press. SDB provides reliable bonding in key manufacturing areas such as automotive wire harnesses, lithium ion batteries, and power electronics.|
|Large Wire Bonder SHB-150H for Manual/Semi-Automatic bonding|
SHB-150H is a manual/semiautomatic wedge bonder for large diameter aluminum or copper bonding wire and ribbon.
The compact table-top unit is ideal for laboratory, prototyping and small scale production.
|Single solder ball placement system STM-II|
|This table-top solder ball mounter for BGA type IC packages is capable of placing a ball of solder with a diameter of 0.2 mm and above. With the touch panel, user can quickly and easily program ball matrix patterns.|
|Precision Reballing Unit SMU-50 for BGA and CSP|
|SMU-50 utilizes metal masks for solder paste and ball placement, making it a high precision solder ball re-balling unit for BGA type IC packages.|
|Vacuum & Pressurized Reflow Soldering Oven VPF200/VPF300|
|Capable of both vacuum and pressurized process, minimize voids in solder joint. Fluxless reflow soldering with formic acid vapor or forming gas is also available. Large work area and rapid cooling system drastically reduce process cycle time in flux-less and void-free soldering.|
|Table-top Batch Reflow Oven SVO-1|
|The SVO-1 is equipped with a highly efficient Carbon Lamp Heater, making the compact reflow the perfect tool for reflow soldering. This versatile heating oven can even be used for curing thermoset adhesive, heat treatment and drying with a constant temperature.|