Vacuum & Pressure Reflow Oven VPF300

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VPF Vacuum & Pressure Reflow Oven is the perfect tool with a wide range of uses, from process development to high-mix low-volume production of fluxless and void-free soldering


The VPF vacuum and pressure reflow oven has a wide heating area coupled with a unique rapid cooling function that expedites the cooling process leading to enhanced productivity.

The VPF is not only capable of the conventional vacuum process but also pressurized process up to 0.4Mpa. This allows for a wide degree of variation of the pressure inside the chamber. Thus, voids in the solder joint can be minimized, resulting in nearly void free soldering.

VPF is also capable of flux-less soldering by the reduction of oxide film by formic acid vapor. The system can be equipped with a formic acid babbler with a liquid temperature control which can supply Nitrogen gas mixed with formic acid at a constant concentration into the process chamber. Forming gas is also available for the same purpose.

With the outstanding functions available on the VPF, users are offered a lot of flexibility in terms of fluxless and void-free soldering.

 vpf300

 

Effective void-free soldering

X-ray images of solder joint between 10x10mm chip and copper substrate using SAC305 solder paste printed in 0.2mm thickness. In the reflow soldering process combined wtih vacuum and pressurizing, nearly void-free solder joint is achieved.
normal-reflow
Normal atmospheric pressure		   vac-soldering
with vacuum		   vac-with-pressure
with vacuum + pressurizing

 

Features and Benefits
  • Wide practicable heating area
  • Rapid cooling function
  • 0.4Mpa pressurizing process available
  • Max. 450 degree C heating capability
  • Flat carbon element IR heater with good thermal uniformity
  • Formic acid bubbler with thermal function
  • Built-in low vibration dry vacuum pump
  • Data logging PC software available
  • Multiple gas lines for various process development
  • Flexible process setting and operation with 7” touch panel
  • Linkage with formic acid monitor (option)
 vpf300_plateHigh rigid process chamber with
Max 0.4Mpa pressurizing capability

 

temp & pressure setting
Setting and editing of temperature, pressure and gas line can be done flexibly on the touch panel.

 
profille image
Temperature and pressure profile can be stored.

 

Basic Specifications

MODEL VPF300
Process area 300mm x 300mm
Max. temperature 450°C
Vacuum level 10Pa (Built-in clean dry vacuum pump)
Max. positive pressure 0.4MPa
Process gases N2 gas, forming gas, N2 mixed with formic acid
Machine size W783mm x D735mm x H1470mm
Weight Approx.200kg
Power AC200V or AC230V Three phase, Max.45A  
Others Formic acid bubbler with temperature control (option)

 

■Related product
Vacuum Reflow Oven TVF200

 

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