Solder Ball Mounter STM-II/STM-II Advance

Table-top Single-shot Solder Ball Placement System “STM-II” is available for high-mix low volume production, R&D and re-balling of BGA.

Solder ball placement can be made with unique solder ball separation unit which is simply interchangable. The system has built-in flux Dispenser with flux temperature controller which enable to apply consistent volume of flux on each ball pads of BGA according to the placement pattern being set beforehand. The machine operation with color wide touch screen enable to simply set various kind of BGA ball placement pattern and parameters. Model STM-II Advance automates the height setting of flux application and ball mounting, making adjustments and settings much easier, and faster the cycle time than those of STM-II.

Ball separation unit is simply interchangeable

Single-shot ball placement on a BGA

Video  0.2mm solder ball placement on 0.15mm ball pad in 0.35mm pitch.

Specification

■Related Products

	Micro solder ball placement system STM-Micro
	STM-Micro meat demand of micro ball mounting, capable of handling micro solder ball of 80micron diameter or above.

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