Solder Ball Mounter STM-II Advance

Table-top Single-shot Solder Ball Placement System “STM-II” is available for high-mix low volume production, R&D and automatic reballing of BGA type IC packages.

Solder ball placement can be made with unique solder ball separation unit which is specially designed per ball size and simply interchangeable. Sine solder ball is precisely mounted one by one onto BGA substrate, very few balls are wasted unlike manual ball mounting using metal stencils.
The machine operation with color wide touch screen enable to simply set various kind of BGA ball matrix pattern.
The system also includes flux dispenser with accurate flux temperature control module which enable to apply consistent volume of flux on each ball pads of BGA according to the BGA pattern being set on the touch panel beforehand.
STM-II Advance provides automated and stable ball placement solution for BGA type IC packages without dependent of operators skill, eliminates time wasting and solder ball losses.

Ball separation unit is simply interchangeable

Single-shot ball placement on a BGA

Ball placement on multiple BGAs

Vision system for automatic offset of ball placement position
and missing ball inspection

Video 0.3mm solder ball placement.

Specification

Ball diameter	0.2mm – 1.0mm dia.
Placement accuracy	within 50 micron (2mil)
Ball placement speed	0.7sec – 0.9sec/sphere
Board size	60mm x 120mm standard, custom fixture for multiple BGAs(option)
Camera unit	Camera for manual alignment and visual inspeciton, vision system available as an option
Utility	100V 5A, or come with external transformer for 110V-230V.
Dimensions	D720 x W880 x H870mm(with LCD monitor)

■Related Products

	Micro solder ball placement system STM-Micro
	STM-Micro meat demand of micro ball mounting, capable of handling micro solder ball of 80micron diameter or above.

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