Solder Ball Mounter STM-II/STM-II Advance

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Table-top Single-shot Solder Ball Placement System model STM-II is available for prototyping, R&D, and repair(re-balling) of BGA type IC packages and substrates.


Solder ball placement can be made with unique solder ball separation unit which is simply interchangable.
The system has built-in flux Dispenser with flux temperature controller which enable to apply consistent volume of flux on each ball pads of BGA according to the placement pattern being set beforehand.
The machine operation with color wide touch screen enable to simply set various kind of BGA ball placement pattern and parameters.

In January 2022, a high-end model STM-II Advance was released in the market. This model ease the setup, secure the accuracy and repeatability with motorized flux dispensing and ball placement and automatic height detection of substrate surface.
  Solder ball mounter STM-II Advance



New ball separation unit makes setup simple
Single-shot ball placement on a BGA


Video  0.2mm solder ball placement on 0.15mm ball pad in 0.35mm pitch.



Ball diameter 0.2mm – 1.0mm dia.
Placement accuracy within 50 micron (2mil)
Placement speed 0.8sec – 1.2sec/sphere
Board size 60mm x 120mm standard (150 x 250mm option)
CCD Camera unit Color CCD camera for placement positioning and visual inspection
Utility 100-120/200-230VAC SP, 5A
Dimensions D720 x W880 x H870mm including LCD monitor


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