Solder Ball Mounter STM-II/STM-II Advance |
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Solder ball placement can be made with unique solder ball separation unit which is simply interchangable. The system has built-in flux Dispenser with flux temperature controller which enable to apply consistent volume of flux on each ball pads of BGA according to the placement pattern being set beforehand. The machine operation with color wide touch screen enable to simply set various kind of BGA ball placement pattern and parameters. In January 2022, a high-end model STM-II Advance was released in the market. This model ease the setup, secure the accuracy and repeatability with motorized flux dispensing and ball placement and automatic height detection of substrate surface. |
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![]() New ball separation unit makes setup simple |
![]() Single-shot ball placement on a BGA |
Video 0.2mm solder ball placement on 0.15mm ball pad in 0.35mm pitch.
Specification
Ball diameter | 0.2mm – 1.0mm dia. |
Placement accuracy | within 50 micron (2mil) |
Placement speed | 0.8sec – 1.2sec/sphere |
Board size | 60mm x 120mm standard (150 x 250mm option) |
CCD Camera unit | Color CCD camera for placement positioning and visual inspection |
Utility | 100-120/200-230VAC SP, 5A |
Dimensions | D720 x W880 x H870mm including LCD monitor |
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