Micro Solder Ball Mounter STM-Micro  

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Capable of handling micro solder ball of 80 µm diameter or above. Single shot ball mounter STM-Micro

Unique single-shot ball separation/singulation method ensures that each solder ball is separated and placed one by one, thus very few balls are wasted. In addition, there is no need to create a metal mask for each BGA pattern, it is possible to quickly respond to the demands such as ball mounting on prototype WLP, single ball mount on a missing ball pad, re-balling, and partial ball mounting for analysis.
Various ball mounting patterns can be simply programmable on the touch panel, the operator just press start so that the machine can automatically carry out everything from flux application to solder ball mounting.
Vision system for position offset correction and missing ball inspection can also be added as an optional feature.

   Micro ball mounter STM-Micro

Features

  • Single ball shot method which singulate and mount solder ball one by one
  • Capable of mounting micro solder balls with a minimum ball diameter of 80μm
  • Dispenser head with temperature controller to stabilize flux application
  • Easy operation with various functions on color touch panel
  • Automatic detection of substrate surface with touch down sensor
  • Ball mount height can be set numerically per ball diameter
  • Ball mounting based on BGA coordinate data (optional)
  • Vision system for position offset correction and missing ball inspection (optional)

    		•    solder ball placement

     


    Ball mount head specially designed for micro solder ball.

     
    Mount 80μm diameter solder balls at 150μm ball pitch.

     

    Video  100 micron solder ball placement at 0.18mm pitch.

     

    Basic specifications

    Ball mount pattern Max. 50 x 50 ball grid array. BGA coordinate data (optional)
    Ball size from 80 micron to 200 micron
    Standard work stage 60mm x 120mm with vacuum holes
    Ball mount functions Single ball, single BGA, multiple BGA
    Storage for BGA patterns Max.50 BGA patterns standaerd
    Dimension D720 x W880 x H870mm
    Weight 85kg
    Power supply AC100V, 3A
    Other accessories Dry vacuum pumps

     

    ■Related Products

    icon Single solder ball placement system STM-II  
    		 
    Table-top solder ball mounter for BGA type IC packages capable of placing solder ball of 0.2mm diameter or above.

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