Large Wire Bonder SHB-150
– Manual/Semi-Automatic wire bonding for large diameter wire and ribbon wire-
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The compact table-top large wire bonder SHB-150 is ideal for laboratory,
prototyping and small scale production of various applications with large diameter aluminum wire, copper wire and flat ribbon wire.

icon Standard Features

Compact bench-top size design
Motorized Y and Z bond head for uniform wire loop control
High accuracy bond force control
Loop Profile Programmable
Wire cutting depth controllable with motorized Z-axis wire cut unit
Color touch panel operation system
Electromagnetic lockable work-stage
Stitch bonding available in different loop height setting
LED light with flexible arm
Mechanical clamp type work holder
USB port for bond parameter saving
Enable deep access bonding and ribbon wire bonding by replacing the minimal interchangeable parts.
Low cost
Deep access bonding with 500um diameter Aluminum wire.
(13mm deep, 10mm between 1st and 2nd bond pad)

icon Specifications

Ultrasonic generator PLL Self tuning 62.5KHz(+/-2.5KHz)
Max Ultrasonic power 50W
Bond time range 1 – 5000msec
Bonding force range 100 – 1500g
Applicable wire diameter 100 – 500um Al wire, up to 300um for Cu wire
Bondable materials Al, Cu wire or Al ribbon (depending on material and thickness of thin metal surface on substrates)
Bonding head movable range 50mm each in Y and Z axis
X-Y Table movable range Within 50 square mm, manual operation.
Power requirement 100 – 120VAC/200 – 240VAC 50/60 Hz
Dimension W750 x D650 x H430mm
System weight approx. 60kg

icon Optional accessories
Stereo Zoom microscope
Custom work stage
Bonding tools