Vacuum & Pressure Reflow Oven VPF300

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VPF Vacuum & Pressure Reflow Oven is the perfect tool with a wide range of uses, from process development to high-mix low-volume production of fluxless and void-free soldering


The VPF vacuum and pressure reflow oven has a wide heating area coupled with a unique rapid cooling function that expedites the cooling process, leading to enhanced productivity.

The VPF is capable of not only conventional vacuum processing but also pressurized processing up to 0.4 MPa. This allows for a wide degree of variation in chamber pressure. Consequently, voids in the solder joints can be minimized, achieving virtually void-free soldering.

VPF is also capable of fluxless soldering through the reduction of oxide films using formic acid vapor. The system can be equipped with a temperature-controlled formic acid bubbler, supplying nitrogen gas mixed with formic acid at a constant concentration into the process chamber. Forming gas is also available for the same purpose.

With these outstanding capabilities, the VPF offers users exceptional flexibility in fluxless and void-free soldering applications.

 Vacuum & Pressure Reflow Oven VPF300

 

Effective void-free soldering

X-ray images of solder joints between a 10×10 mm chip and a copper substrate using SAC305 solder paste printed at a 0.2 mm thickness. By combining vacuum and pressurization during reflow, nearly void-free solder joints are achieved.

Normal atmospheric pressure
Normal atmospheric pressure 		With vacuum
With vacuum 		With vacuum and pressurizing
With vacuum + pressurizing

 

Features and Benefits
  • Wide practicable heating area
  • Rapid cooling function
  • Pressurizing process capability up to 0.4 MPa
  • Max. 450°C heating capability
  • Flat carbon element IR heater with excellent thermal uniformity
  • Formic acid bubbler with temperature control
  • Built-in low-vibration dry vacuum pump
  • Data-logging PC software available
  • Multiple gas lines for versatile process development
  • Flexible process setup and operation via 7” touch panel
  • Integration with optional formic acid monitor
 VPF300 process chamber
Highly rigid process chamber with
Max. 0.4 MPa pressurizing capability

 

Temperature and pressure setting
Temperature, pressure, and gas lines can be configured and edited flexibly via the touch panel.
Profile data image
Temperature and pressure profiles can be stored.

 

Basic Specifications

MODEL VPF300
Process area 300 mm x 300 mm
Max. temperature 450°C
Vacuum level 10 Pa (Built-in clean dry vacuum pump)
Max. positive pressure 0.4 MPa
Process gases N2 gas, forming gas, N2 mixed with formic acid
Machine size W783 mm x D735 mm x H1470 mm
Weight Approx. 200 kg
Power AC 200V / AC 230V Three-phase, Max. 45A
Options Formic acid bubbler with temperature control

 

■Related product
Vacuum Reflow Oven TVF200

 

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