Table-top Vacuum Reflow Oven TVF200

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Cost-effective, space-saving tabletop vacuum reflow oven capable of heating up to 450°C, featuring standard fast cooling and optional formic acid reduction.

The TVF200 vacuum soldering process significantly reduces voids inside solder joints by modulating the chamber pressure, achieving high-quality, void-free soldering.

Featuring an effective heating area of 200 mm × 200 mm with 50 mm clearance in height, it supports heating from both the top and bottom of the workpiece. The chamber pressure can be flexibly controlled from atmospheric pressure down to 10 Pa, and both pressure and temperature profiles can be easily programmed via the intuitive touch panel.

By utilizing the optional formic acid bubbler unit with temperature control, a formic acid and nitrogen gas mixture is supplied at a stable concentration. This reduction process removes surface oxide films, enabling flux-free soldering.

Soldering process example

TVF200 Vacuum Reflow Oven
Void Reduction Effect by Vacuum Reflow Soldering
X-ray inspection images of 10 × 10 mm copper sample pieces after reflow soldering.
The left image shows conventional reflow soldering at atmospheric pressure, while the right image shows vacuum reflow soldering under modulated chamber pressure.
Reflow soldering X-ray comparison
• In atmospheric reflow, voids remain trapped inside the solder as it solidifies without pressure variation.
• By reducing the pressure in the process chamber from atmospheric pressure down to approximately 10 Pa, voids in the solder joint are drastically reduced.

TVF200 Features

  • 200 × 200 mm effective heating area
  • Heating capability up to 450°C
  • Individual power adjustment for each IR heater
  • Reduced cycle times with rapid cooling function
  • Flexible process profiling based on time, temperature, and pressure
  • 4 thermocouples included for in-chamber temperature measurement
  • Equipped with 3 gas supply lines
  • Formic acid bubbler unit for N₂/HCOOH mixed gas (optional)

Chamber open view

TVF200 Options and Accessories

Options such as dry vacuum pumps, formic acid bubblers, and dedicated mounting racks are available.

Specifications

Effective heating area 200 mm × 200 mm
Set temperature Max. 450°C
Ultimate vacuum 10 Pa (depends on dry pump specification)
Supported gases N₂, Formic acid mixed gas, Forming gas, He, etc.
Dimensions W622 mm × D597 mm × H775 mm (including signal tower)
Weight Approx. 65 kg
Power supply 3-phase 200 V, 8 kW

■ Related Product
Vacuum & Pressure Reflow Oven VPF300

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